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A giant golden dollar sign emerges through the floor with a bold arrow, symbolizing rising costs, while NAND and DRAM memory chips fly around it, illustrating the sharp price hikes in the global Memory Market. Banner for ASC Global’s Component Compass report.

Last Updated: 9/19/25

Global Memory Prices Surge Amid Supply Tightening Pressures

NAND flash and DRAM prices are rising sharply due to supply shortages and AI-driven demand. SanDisk, Micron, and Phison lead hikes, with DRAM increases reaching 70% for automotive use, while server NAND demand will spike into 2026.

SanDisk Sees Strong NAND Demand Driving Price Hikes

Data center AI inference demand fuels NAND shortages. SanDisk hikes prices 10%, expands BICS 8 adoption, and develops High Bandwidth Flash (HBF) with SK hynix, targeting 512GB-per-stack systems by 2027 to meet growing enterprise and cloud memory needs.

Micron Freezes Quotes, Eyes 20-30% Memory Price Hikes

Micron has suspended memory product price quotes, signaling 20-30% increases in DRAM and NAND. Demand from cloud/hyperscale, tight supply, and storage shortage are key drivers. Expected effects in industrial & AI sectors.

China Initiates Anti-Dumping Probe into U.S. Analog Chips Imports

China’s Ministry of Commerce is investigating alleged dumping of U.S. analog chips (TI, ADI, Broadcom etc.), particularly 40nm+ analog and gate driver chips. Pricing dropped 52% while imports rose, harming domestic producers.

Intel Confirms Altera Sale, Lowers 2025 Op-Expenses Amid Restructuring

Intel sold a 51% stake in Altera to Silver Lake for $3.3B, trimming its 2025 operating expenses target to $16.8B. Post-deal, Altera becomes an independent FPGA firm with Intel retaining 49%.

TSMC Plans 5-10% Price Hike for Nodes Below 5nm Next Year

Advanced semiconductor nodes (below 5nm), including 2nm, will see wafer price increases of 5-10% starting 2026, as TSMC faces rising costs. Mature nodes may see stable or reduced prices.

More Component Compass news

Japan Backs Micron With $3.6B for DRAM Expansion

Japan’s METI will grant Micron $3.6B to expand Hiroshima DRAM production, supporting AI-focused chips. Micron pledges 1.5T yen by 2029, with mass output by 2028, strengthening Japan’s semiconductor supply chain alongside TSMC and Kioxia projects.

AWS Greater China Faces Cuts Amid Global Tech Layoffs

AWS Greater China may lay off 20–30% of staff due to low productivity and weak Q2 results. Amazon confirms wider cloud division reductions, while Oracle and Microsoft continue global workforce streamlining amid AI and cost priorities.

Samsung Delays V9 QLC NAND Roll-out to First Half 2026

Samsung’s V9 QLC NAND, featuring 280 layers, is delayed into 1H 2026 due to performance issues. Meanwhile SK hynix has already started mass production of its 321-layer QLC NAND, gaining edge in high-capacity storage market.

ROHM Unveils Compact High-Power DOT-247 SiC Module

ROHM’s DOT-247 2-in-1 SiC module combines two TO-247 structures, cutting thermal resistance and inductance, doubling power density, and supporting half-bridge and common-source topologies for PV inverters, UPS systems, and multi-level industrial power conversion circuits.

ST Expands Panel-Level Packaging Production in France

ST will add a $60M PLP line in Tours by Q3 2026, leveraging Direct Copper Interconnects to boost efficiency, power density, miniaturization, and heat dissipation, complementing its Malaysia line and supporting next-generation chip development in Europe.

UK-US Deal Sparks $42 Billion AI Investment Surge

The $42B UK-US “Tech Prosperity Deal” includes Nvidia, Microsoft, Google, Salesforce, and BlackRock investments in AI, quantum computing, and datacentres. Projects like Nvidia’s 120,000-GPU Stargate UK deployment aim to accelerate innovation, economic growth, and scientific breakthroughs.

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