IRFP4227PBF
Category: MOSFETs , Single MOSFETs Infineon
Infineon This HEXFET Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch applications in Plasma Display Panels. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°Coperating junction temperature and high repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for PDP driving applications. Packaging: RALSupplier Type: Authorized Distributor1,782 Qty Price 25 2.8981 30 2.8128 60 2.7276 130 2.6424 250 2.5571 1,300 2.4719 2,500 2.3867
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IRLR024NTRPBF
Category: MOSFETs , Single MOSFETs Infineon
Infineon Fifth Generation HEXFET Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications. Packaging: TRSupplier Type: Authorized Distributor6,000 Qty Price 2,000 0.4084 4,000 0.396 8,000 0.3836 12,000 0.3713 16,000 0.3589 20,000 0.3465 200,000 0.3341
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IRF7416TRPBF
Category: MOSFETs , Single MOSFETs Infineon
Infineon Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The SO-8 has been modified through a customized lead frame for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application. Packaging: TAPSupplier Type: Authorized Distributor644 Qty Price 1 1.214 10 1.0007 25 0.9263 50 0.8519 100 0.7775
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